Dowsil EI-2888 – Primerless silicone encapsulant

Dowsil EI-2888 Primerless Silicone Encapsulant is a groundbreaking two-part liquid component engineered by Dow Inc., designed to deliver high-performance encapsulation solutions across a diverse range of applications. This advanced product is crafted to offer exceptional reliability and ease of use. Whether you are focusing on encapsulating rigid or flexible circuit boards, LED lighting, or high-ingress protection rated luminaires, Dowsil EI-2888 stands as the exemplary choice for all your encapsulation requirements.

Product Properties

• Primerless Application: Eliminates the need for an additional primer, simplifying processes and reducing costs.
• Two-Part System: Comprising Part A and Part B that require thorough mixing to ensure consistent and reliable curing.
• Flexible and Adaptable: Boasts high flexibility, conforming seamlessly to the shape of encapsulated components.
• Thermal Stability: Ensures components remain protected under diverse temperature conditions.
• Electrical Insulation: Provides superior electrical insulation, enhancing longevity and preventing short circuits.
• Clear and Transparent Formulation: Ideal for applications where visibility of components is crucial.

Product Applications

• LED Lighting: Optimal for encapsulating both rigid and flexible circuit boards in LED lighting, suited for both indoor and outdoor environments.
• High-Ingress Protection Rated Luminaires: Offers excellent defense against dust and water ingress, perfect for high-ingress protection rated applications.
• Explosion-Proof Lighting: Meets stringent requirements for explosion-proof lighting, ensuring reliability in hazardous environments.
• Electronics Encapsulation: Ideal for encapsulating sensitive electronic components, providing comprehensive mechanical and electrical protection.

Typical Properties

• Color Clear
• Cure Type Heat Cure, Room Temperature Cure
• Dielectric Strength 480 volts per mil v/mil
• Durometer – Shore 00 60
• Opacity Transparent
• Specific Gravity @ 25°C 0.99
• Thermal Conductivity 0.15 W/m・K
• Viscosity 2700 mPa.s

Certifications & Standards

• UL Recognized