DOWSIL™3-6096 Silicone Adhesive High Temperature

DOWSIL™ 3-6096 Adhesive is a one-component, non-flowing, silicone adhesive with rapid heat cure. It forms high-strength, medium modulus flexible bonds to metal, glass and other substrates with improved adhesion properties when exposed to high temperatures > 200°C, especially if adhesion in a humid environment is asked for.

Applications

• Designed to provide flexible yet structurally strong bonding of various substrates with dissimilar thermal expansion rates such as metal, glass and plastic when a very fast cure is needed
• Typical applications include bonding of domestic oven doors, and assembling of ceramic cooking hobs.

Features

• Easy-to-use one-component adhesive/sealant
• Addition cure system
• Cures to a tough, flexible rubber
• Excellent adhesion to a wide range of substrates such as glass, metals and plastics
• Rapid heat cure
• Excellent heat resistance (up to 250ºC)
• Stable and flexible over wide temperature range (from -40°C to +250°C)
• Color Black
• Cure time: For complete cure and, more importantly, for optimum adhesion, DOWSIL 3-6096 Adhesive should be cured using one of the following recommended schedules:
  • 5 minutes at 180°C
  • 15 minutes at 150°C
  • 1 hour at 120°C
•  As cured (1 hr at 150°C) Physical properties measured after 24 hr at RT
  • Durometer Hardness, Shore A 45
  • Specific Gravity 1.3
  • Tensile Strength MPa 3.65
  • 100% Modulus MPa 1.4
  • Elongation at Break % 215
  • Tear Strength, Die B N/mm2  7

Substrate preparation

For best adhesion, all surfaces should be cleaned and degreased with a suitable solvent. Care should be taken to ensure that all solvent is removed. DOWSIL 3-6096 Adhesive has been formulated to provide unprimed adhesion to a variety of substrates such as metals, glass and plastics. Good adhesion cannot be expected on low surface energy substrates such as polytetrafluoroethylene, polyethylene and polypropylene. Special surface treatments such as chemical etching, flame or plasma treatment are required to give a reactive surface and promote adhesion to these substrates. Substrates which melt at or below the cure temperature of DOWSIL 3-6096 Adhesive should not be used.