Permabond ES558 Single-part, heat-cure Epoxy

Permabond ES558 Single-part, heat-cure Epoxy is the ultimate adhesive solution for industries demanding high-strength and reliable bonds. Designed for professionals, this versatile adhesive is perfect for automotive, aerospace, and electronics applications. Its single-component design simplifies application by eliminating mixing, while its heat-cure technology allows it to flow like solder, effectively filling small gaps in complex assemblies. With outstanding impact resistance and compatibility with materials like metal, glass, and plastic, Permabond ES558 ensures durable performance even under stress. Elevate your project quality and efficiency with this innovative adhesive, a testament to cutting-edge technology and industrial precision.

Permabond ES558 Single-part, heat-cure Epoxy

General Description

Permabond ES558 Single-part, Heat-cure Epoxy is a cutting-edge solution in the realm of industrial adhesives, offering exceptional bonding capabilities for a diverse array of materials. As a single-part epoxy, it simplifies the application process, eliminating the complexities associated with multi-part systems. The ES558 is engineered to cure with heat, enhancing its capacity to form robust and durable bonds, which makes it indispensable for settings where high-strength adhesion is imperative.

Product Properties

  • Single-component Epoxy: The ES558’s formulation does not require mixing, thereby streamlining its application and minimizing error potential.
  • Heat-cure Technology: When exposed to heat, the adhesive flows with solder-like properties, enabling it to penetrate and bond complex geometries and minute gaps effectively.
  • High Impact Resistance: This epoxy is fortified to resist impacts, ensuring bond integrity even under substantial stress and mechanical strain.
  • Versatile Material Compatibility: Capable of bonding materials like metal, glass, and plastic, ES558 is a versatile adhesive solution suitable for a wide spectrum of industrial applications.
  • Temperature Resilient: Designed to endure elevated temperature conditions, ensuring reliable performance in high-temperature environments.

Product Applications

  • Automotive Industry: Utilized for securing metal components in automotive parts, providing strong joints that can withstand the operational demands of vehicles.
  • Aerospace Industry: Ideal for aerospace manufacturing where the strength and reliability of bonds at increased temperatures are critical.
  • Electronics Industry: The adhesive’s flow-like characteristic when heated makes it suitable for bonding electronic components, filling small and intricate gaps effectively.
  • General Industrial Use: Appropriate for a variety of applications, such as bonding plastic components, machinery repairs, and complex assembly projects.
  • Repair and Maintenance: Provides high-strength bonds necessary for effective machinery and equipment repairs.
  • Prototyping and Testing: The ease of application and robust bonding make ES558 an excellent choice for prototyping new designs and conducting tests in controlled environments.

TDS / MSDS

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TDS / MSDS

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Technical Data sheet and safety data sheet

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