Permabond ES560 1K Heat-Cure Epoxy for Electronics

Applications

• Ideal for electronics potting and encapsulation applications, as well as underfilling and reworking microchips

Features

• Excellent adhesive strength
• Excellent resistance to vibration
• Easy to use – no mixing required
• Low viscosity

Surface Preparation

• Surfaces should be clean, dry and grease-free before applying the adhesive. Use a suitable solvent (such as acetone or isopropanol) for the degreasing of surfaces.
• Some metals such as aluminium, copper and its alloys will benefit from light abrasion with emery cloth (or similar), to remove the oxide layer.

Directions for Use

1. The adhesive should be dispensed from the cartridge via the nozzle supplied (this can be cut to give the appropriately sized bead to cover the bond area).
2. Apply the adhesive to one surface and avoid entrapping air.
3. Assemble parts applying sufficient pressure to ensure the adhesive spreads to cover the entire bond area.
4. Use a jig/clamp to prevent parts from moving during cure.
5. It is advisable not to disturb the joint until the adhesive is fully cured.
6. Cure with heat – see page one for cure schedule